Integrated Stress State Sensors for 

FLIP CHIP Applications
Measure the Complete Stress State

Both In-plane and Out-of-Plane Stresses 

Insure Reliability of Your Packages
JS Engineering Supplies the Die & Calibration Coefficients

Your Company Packages the Devices and Extracts Stress State Information

OR

JS Engineering Extracts the Stress State Information for You

 

An Array of Die Sizes to Fit Your Application

  • Standard Sizes: 
    • 2.5 mm x 2.5 mm
    • 5 mm x 5 mm
    • 10 mm x 10 mm
  • Wafer Thickness - 25 mils

Other Thicknesses Available Upon Request
FC100
  • 2.5 mm x 2.5 mmTest Die
  • 200 um Pitch Perimeter Bumped
  • 4 Sensor Rosettes
  • 8-bit Chip ID
  • Diode Thermometry
FC200
  • 5 mm x 5 mm Test Die
  • 200 um Pitch Perimeter Bumped
  • 11 Sensor Rosettes
  • 8-bit Chip ID
  • Diode Thermometry


 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 

 

 

 

FC400

  • 10 mm x 10 mmTest Die
  • 200 um Pitch Perimeter Bumped
  • 19 Sensor Rosettes
  • 10-bit Chip ID
  • Diode Thermometry
  • Sub Surface Heater - Full Die Area

 
 

 
 
 

 

 

Flip Chip Test Die (PDF)

Wire Bond Test Die

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